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| ILX751B 2048-pixel CCD Linear Sensor (B/W) Description The ILX751B is a reduction type CCD linear sensor designed for facsimile, image scanner and OCR use. This sensor reads B4 size documents at a density of 200DPI (Dot Per Inch). Featuring a shutter funcyion, correspondences with the sensitivity correction, etc, is possible. A built-in timing generator and clockdrivers ensure direct drive at 5V logic for easy use. Features * Number of effective pixels: 2048 pixels * Pixel size: 14m x 14m (14m pitch) * Built-in timing generator and clock-drivers * Shutter function * Ultra low lag * Maximum clock frequency: 5MHz Absolute Maximum Ratings * Supply voltage VDD1 VDD2 * Operating temperature * Storage temperature Pin Configuration (Top View) NC 16 Preliminary 22 pin DIP (Cer-DIP) Block Diagram Shutter gate pulse generator NC 10 GND Read out gate CCD analog shift register Shutter drain Shutter gate NC 14 Clock-drivers Mode selector NC 15 Clock pulse generator Sample-and-hold pulse generator VOUT NC NC SHSW CLK NC NC VDD2 SHUT NC ROG 1 2 3 4 5 6 7 8 9 10 11 2048 1 22 VDD2 GND 21 VDD2 20 VDD1 19 GND VDD1 20 VDD2 17 GND Output amplifier Sample-and-hold circuit 16 NC NC 18 15 NC 14 NC 13 NC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- PE01Y37 VOUT 12 GND 1 NC 2 NC 3 NC 6 NC 18 NC 22 7 VDD2 8 CLK 17 5 GND 19 VDD2 21 S2048 S2047 11 6 -10 to +55 -30 to +80 V V C C Read out gate pulse generator 12 SHSW NC 13 4 ROG 11 SHUT 9 D39 D38 D37 D36 D35 D34 D33 D15 D14 S2 S1 ILX751B Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol VOUT NC NC SHSW CLK NC NC VDD2 VDD2 NC ROG Description Signal output NC NC Switch { With S/H GND Without S/H VDD2 Clock pulse NC NC 5V power supply 5V power supply NC Clock pulse Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol GND NC NC NC NC GND NC GND VDD1 VDD2 VDD2 GND NC NC NC NC GND NC GND 9V power supply 5V power supply 5V power supply Description Recommended Supply voltage Item VDD1 VDD2 Min. 8.5 4.75 Typ. 9.0 5.0 Max. 9.5 5.25 Unit V V Note) Rules for raising and lowering power supply voltage To raise power supply voltage, first raise VDD1 (9V) and then VDD2 (5V). To lower voltage, first lower VDD2 (5V) and then VDD1 (9V). Mode Description Mode in use S/H Yes No Input Capacity of Pins Item Input capacity of CLK pin Input capacity of ROG pin Input capacity of SHUT pin Symbol CCLK CROG CSHUT Min. -- -- -- Typ. 10 10 10 Max. -- -- -- Unit pF pF pF Pin condition Pin 4 SHSW GND VDD2 Recommended Input Pulse Voltage Item Input clock high level Input clock low level Min. 4.5 0 Typ. 5.0 -- Max. 5.5 0.5 -2- Unit V V ILX751B Electro-optical Characteristics (Ta = 25C, VDD1 = 9V, VDD2 = 5V, Clock frequency = 1MHz, Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm)) Item Sensitivity Sensitivity nonuniformity Saturation output voltage Dark voltage average Dark signal nonuniformity Image lag Dynamic range Saturation exposure 9V supply current 5V supply current Total transfer efficiency Output impedance Offset level Shutter lag R PRNU VSAT VDRK DSNU IL DR SE IVDD1 IVDD2 TTE ZO VOS SHUT Symbol Min. (30) -- (1.5) -- -- -- -- -- -- -- 92.0 -- -- 0 Typ. 40 2.0 1.8 0.3 0.5 0.02 6000 0.045 4.0 1.8 97.0 600 4.0 1.0 Max. (50) (8.0) -- (2.0) (3.0) -- -- -- (8.0) (5.0) -- -- -- (5.0) Unit V/(lx * s) % V mV mV % -- lx * s mA mA % V % Remarks Note 1 Note 2 -- Note 3 Note 3 Note 4 Note 5 Note 6 -- -- -- -- Note 7 Note 8 Note) 1. For the sensitivity test light is applied with a uniform intensity of illumination. 2. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1. PRNU = (VMAX - VMIN)/2 VAVE The maximum output is set to VMAX, the minimum output to VMIN and the average output to VAVE. 3. Integration time is 10ms. 4. VOUT = 500mV 5. DR = VSAT VDRK When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in proportion to optical accumulated time. 6. SE = VSAT R 7. VOS is defined as indicated below. D31 OS D32 D33 S1 x 100 [%] VOS GND -3- ILX751B 8. To stipulate the lag during shutter opetation, use the formula below. Place the output voltage average value during shutter operation at VSHUT and the output Voltage average value when the shutter is not in operation at VAVE. (Refer to Fig. 5.) SHUT= VSAT R Please note that the shutter pulse at this time accord with Fig.5. x 100 [%] -4- Fig.1. Clock Timing Diagram (without S/H mode) 5 ROG 0 2087 1 2 3 4 1 5 CLK 0 VOUT Optical black (18 pixels) Dummy signal (33 pixels) Effective picture elements signal (2048 pixels) 1-line output period (2087 pixels) S2045 S2046 S2047 S2048 D34 D35 D36 S37 S38 D39 D11 D12 D13 D14 D15 D31 D32 D33 S1 S2 S3 S4 D2 D3 D4 D5 D6 Dummy signal (6 pixels) 2 -5- ILX751B ILX751B Fig. 2. CLK , VOUT Timing t1 t2 CLK t3 t4 t5 VOUT t6 Item CLK pulse rise/fall time CLK pulse duty1 CLK - VOUT1 CLK - VOUT2 1 100 x Symbol Min. 0 40 50 30 Typ. 10 50 80 75 Max. -- 60 110 120 Unit ns % ns ns t1, t2 -- t5 t6 t3 / (t3 + t4) Fig. 3. ROG, CLK Timing ROG t8 t9 t10 CLK t7 t11 Item ROG, CLK pulse timing ROG pulse rise/fall time ROG pulse period Symbol Min. 500 0 500 Typ. 1000 10 1000 Max. -- -- -- Unit ns ns ns t7, t11 t8, t10 t9 -6- ILX751B Fig. 4. SHUT Timing SHUT t12 t13 t14 Item SHUT pulse rise/fall time SHUT pulse period Symbol Min. 0 500 Typ. 10 1000 Max. -- -- Unit ns ns t12, t13 t14 -7- Fig.5. Shutter Operation Mode Clock 5 ROG 0 5 CLK 0 2087 bits or more 5 SHUT 0 1ms -8- Illumination Light source ON During shutter lag evaluation, the light source will be accompanied by a flash. ILX751B Fig.6. Shutter Pulse and Output Voltage ROG 5V 0V Illumination ON OFF ON OFF ON OFF -9- SHUT VOUT 5V 0V Shutter ON VSHUT VAVE ILX751B ILX751B Description of Shutter Pin 9 1) The state at 5V is when the shutter is not in operation. 2) When dropped to 0V, the shutter gate will open, letting the accumulated charge of the sensor be thrown away to the shutter drain. ROG 5V 0V The charge is sent to the transfer register as signal charge. Accumulated charge of the sensor The charge up to this point will be thrown away to the shutter drain. SHUT 5V 0V Shutter gate ON - 10 - ILX751B Example of Representative Characteristics Spectral sensitivity characteristics (Standard characteristics) 1.0 0.9 0.8 Relative sensitivity Ta = 25 C 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wavelength [nm] 800 900 1000 Dark signal voltage rate vs. Ambient temperature (Standard characteristics) VDD1, VDD2 supply current vs. Clock frequency (Standard characteristics) IVDD1 IVDD2 10 10 1 IVDD1, IVDD2 - VDD1, VDD2 supply current [mA] 5 5 Dark signal voltage rate 1 0.5 0.5 0.1 0 10 20 30 40 50 60 Ta - Ambient temperature [ C] 0.1 0.1M 1M Clock frequency [Hz] 5M - 11 - Application Circuit 1 5V 9V 22 VDD2 (D) 21 VDD2 (D) 20 VDD1 (A) 19 GND (A) 18 NC 17 GND (A) 16 NC 15 NC 14 NC 13 NC 12 GND (D) ROG VDD2 (D) - 12 - 0.01 10/16V 3k Output signal SHUT SHSW CLK VOUT NC NC NC NC 1 2 3 4 5 6 7 8 9 10 NC 11 0.01 CLK 2SA1175 SHUT ROG 22/10V ILX751B Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX751B Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an eath band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) lonized air is recommended for discharge when handling CCD image sensors. e) For the shipment of mounted substrates use cartons treated for the prevention of static charges. 2) Notes on handling CCD Cer-DIP package The following points should be observed when handling and installing Cer-DIP packages. a) Remain within the following limits when applying static load to the ceramic portion of the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N 0.9Nm Lower ceramic layer (1) Low-melting glass (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic layers are shielded by low-melting glass. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with a soldering iron. (3) Rapid cooling or heating. (4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes demage to the glass abd other defects. Use a 30W soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount image sensors, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. - 13 - ILX751B 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface blow it off with an air blower. (For dirt stuck through static electricity, ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 14 - Package Outline Unit: mm 22 pin DIP (400mil) 41.6 0.5 7.35 0.5 22 28.672 (14m X 2048Pixels) 12 5.0 0.5 H 1 No.1 Pixel 11 1. The height from the bottom to the sensor surface is 2.45 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 4.0 0.5 2.54 0.51 0.3 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS Cer-DIP TIN PLATING 42 ALLOY 5.20g LS-A18-01(E) DRAWING NUMBER 4.35 0.5 3.65 M 0.25 V 10.0 0.5 0 to 9 - 15 - Sony Corporation ILX751B |
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